TDEI Special Issue

The call for papers can be downloaded here.

Information on submitting to the IEEE Transactions on Dielectrics and Electrical Insulation Special Issue will be posted here as the deadline nears. The preliminary deadline for submission is August 31, 2016. The transactions will be published in August of 2017.

Questions on the TDEI special issue can be directed to the special issue guest editor, Dr. Hulya Kirkici (